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HT7612/HT7612B General Purpose PIR Controller
Features
* Operating voltage: 2.7V ~ 5.5V * Standby current typical: * 40 second power-on delay * 10 second high speed warm-up for test mode * 1~3783 second adjustable PIR turn on time. * Output drive for Relay, TRIAC and LED * Output drive buzzer alarm * Low voltage detector * Override function * 16-pin DIP/NSOP packages
HT7612: 17mA HT7612B: 19mA
* CDS input * CDS debounce time:
HT7612: 15~20 seconds HT7612B: < 3 seconds
* High noise immunity
Applications
* PIR light control * Motion detectors * Alarm system * Auto door bells
General Description
The HT7612/HT7612B is PIR controller specifically designed to interface to PIR sensors to implement motion sensing application products such as intruder alarms. The controller has the features of PIR sensitivity adjustment and a CDS can be connected to the controller for automatic detection. The HT7612/HT7612B is available in low profile NSOP & DIP packages.
Block Diagram
VDD VSS
O P2O O P2N O P1O O P1N O P1P A m p lifie r C ir c u it C o m p a ra to r C ir c u it
VREF
LDO & R e fe r a n c e V o lta g e
B U Z /L V D B U Z /C D S
DT
T im in g D e la y
C o n tro l C ir c u it
R E L A Y /L E D T R A IC
T E S T /S C
S y s ta m O s c illa to r
ZC MODE
Rev. 1.50
1
February 21, 2011
HT7612/HT7612B
Pin Assignment
O P1P 1 2 3 4 5 6 7 8 9 O P1N O P1O O P2N O P2O VREF DT VSS 16 15 14 13 12 11 10 T E S T /S C ZC B U Z /L V D B U Z /C D S MODE R E L A Y /L E D T R IA C VDD
H T 7 6 1 2 /H T 7 6 1 2 B 1 6 D IP -A /N S O P -A
Pin Description
Pin Name OP1P OP1N OP1O OP2N OP2O VREF DT I/O I I O I O O I Mask Option PMOS PMOS CMOS PMOS CMOS NMOS PMOS OP1 Non-inverting Input OP1 Inverting Input OP1 Output OP2 Inverting Input OP2 Output Reference Voltage Delay time oscillator input. Connected to an external RC to adjust the output duration. TEST and SC share the same pin. TEST is used to test the 32 Khz system frequency. SC is used to detect LVD and CDS. Negative power supply, ground Positive power supply RELAY and LED share the same pin. Active high - a RELAY is driven through an external NPN transistor. BUZ and CDS share the same pin. The BUZ output can drive a piezo buzzer. CDS is connected to a CDS voltage divider for daytime/night auto-detection. A low input to this pin can disable the PIR input. CDS is connected to the input of a internal comparator with a debounce time of 15~20 seconds for the HT7612 and less than 3 seconds for the HT7612B. BUZ and LVD share the same pin. The BUZ output can drive a piezo buzzer LVD is used as an input low voltage detector. AC zero crossing detector input. TRIAC output drive. The output is a pulse output when active. Operating mode selection input. VDD: Output is always ON VSS: Output is always OFF Open: Auto detection Test Mode Input. Description
TEST/SC VSS VDD RELAY/LED
O 3/4 3/4 O
CMOS 3/4 3/4 CMOS
BUZ/CDS
I/O
CMOS
BUZ/LVD ZC TRIAC
I/O I O
CMOS 3/4 CMOS
MODE
I
CMOS
Rev. 1.50
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February 21, 2011
HT7612/HT7612B
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V Input Voltage..............................VSS-0.3V to VDD+0.3V Zero Crossing Current ................................Max. 300mA Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Storage Temperature ............................-50C to 125C Operating Temperature...........................-40C to 85C
Electrical Characteristics
Symbol VDD VREF IREF Parameter Operating Voltage Reference Voltage - see Note Driving Current Test Conditions VDD 3/4 5V 5V Cf=1mF 3/4 HT7612: DT off, OPAMP off, VREF no load HT7612B: DT off, OPAMP on, VREF no load VOH=4.5V VOL=0.5V VOH=4.5V VOL=0.5V VOH=4.5V VOL=0.5V 3/4 3/4 3/4 3/4 CL=10pF 3/4 3/4 VREF, RDT=30kW, CDT=3000pF RL=510kW to VSS RL=510kW, CL=100pF 1/2 VREF + 1/6 VREF 1/2 VREF - 1/6 VREF Conditions 3/4 Min. 2.7 3.201 200 3/4 3/4 -20 20 -5 10 -5 10 0.7VDD 3/4 0.7VDD 3/4 3/4 0.99 28.8 15.2 60 2.5 1.98 0.99 Typ. 4.0 3.300 3/4 17 19 -40 40 -10 20 -10 20 3/4 3/4 3/4 3/4 10 1.10 32.0 16.0 80 5.0 2.20 1.10 Max. 5.5 3.399 3/4 23 25 3/4 3/4 3/4 3/4 3/4 3/4 3/4
Ta=25C Unit V V mA mA mA mA mA mA mA mA mA V V V V mV V kHz kHz dB kHz V V
ISTB
Standby Current
5V
IOH1 IOL1 IOH2 IOL2 IOH3 IOL3 VIH VIL VTH1 VTL1 VOS VLVD fSYS fDT AVO GBW VH VL Note:
TRIAC Source Current TRIAC Sink Current BUZ & BUZ Source Current BUZ & BUZ Sink Current RELAY/LED Source Current RELAY/LED Sink Current MODE High Input Voltage MODE Low Input Voltage ZC High Transfer Voltage ZC Low Transfer Voltage OP Amp Input Offset Voltage Low Voltage Detector Voltage System Oscillator Frequency - IRC Delay Time Frequency - ERC OP Amp Open Loop Gain OP Amp Gain Band Bandwidth High Level Comparator Window Low Level Comparator Window
5V 5V 5V 5V 5V 5V 3/4 3/4 3/4 3/4 5V 3/4 5V 3/4 5V 5V 5V 5V
0.3VDD 3/4 0.3VDD 3/4 1.21 35.2 16.8 3/4 3/4 2.42 1.21
When VDD is less than 3.4V, then the VREF voltage will be equal to VDD. If the VREF voltage is less than the PIR working voltage, then the PIR sensor will not work normally.
Rev. 1.50
3
February 21, 2011
HT7612/HT7612B
Functional Description
The following gives a description of the functional pins on the device. TEST The TEST pin is an output which is used to test the 32 KHz system frequency. Note that the pin is a shared TEST/SC pin. The TEST output pin can be used within 1 second after power-on. SC The SC pin is an output pin which is used to for LVD and CDS detection. Note the pin is a shared TEST/SC pin. The SC pin can be used 1 second after power-on. DT The DT pin is a delay time oscillator input pin. It is connected to an external RC to obtain the desired output turn-on duration. Variable output turn-on durations can be achieved by selecting various values of RC or using a variable resistor. The DT structure is shown in Fig.1.
V
REF
RELAY
B U Z /L V D
B U Z /C D S
Fig.2 Buzzer Pin Drive Buzzer The RELAY pin is a CMOS output structure which is normally low and active high. The high duration is controlled by the delay time oscillator and the MODE pin. The RELAY pin structure is shown in Fig.3.
V
DD
LO AD AC
R E L A Y /L E D
10kW
R ELAY 8050
_ + DT _ + Com p O s c illa to r Com p SR FFI CLK
Fig.3 RELAY Pin Drive RELAY TRIAC The TRIAC pin is a CMOS output structure which will output a series of pulses when active. The pulse train is synchronised by the ZC (zero crossing) input. The active duration is controlled by the delay time oscillator and the MODE pin. The TRIAC structure is shown in Fig.4.
LO AD
Fig.1 DT Oscillator Structure BUZ/BUZ The BUZ & BUZ pins are both CMOS output structures. They will output 4 beep sounds within 1second to indicate that the warm-up time has completed. These differential output pins can be used to drive a piezo buzzer. The BUZ/BUZ structure are shown in Fig.2.
T R IA C 0 .0 4 7 m F
68W 10kW
T R IA C
AC
Fig.4 TRIAC Pin Drive TRIAC
Rev. 1.50
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HT7612/HT7612B
MODE The MODE pin is a tristate input which is used to select the desired device operating mode. MODE pin Operating Status Mode VDD ON Description Output is always ON: RELAY output high for RELAY driving. TRIAC pulse train output is synchronised by ZC for TRIAC driving. Output is always OFF: RELAY output low for RELAY driving. TRIAC output low for TRIAC driving. Outputs remain in the OFF state until activated by a valid PIR input trigger signal. When working in the AUTO mode, the devices allows for an override control by switching the ZC signal.
VSS
OFF
OPEN
AUTO
The device also provides an additional test function on the MODE pin. If the MODE pin is presented with a high pulse, of greater than 400ms duration, within 1 second after power-on, the device will be forced into its test mode. When the device enters the test mode the power-on delay time will be changed from its normal operating value of 40 seconds to 10 seconds. ZC
device is overridden to ON and there is no further override operations, it will automatically return to the AUTO mode after 8 hours. It will flash 3 times at a 1Hz rate when returning to the AUTO mode. But if the AUTO mode is changed by switching the MODE switch, it will not flash, as shown in Fig.5. In Fig.6, an external pull-high resistor is required for normal applications.
V
DD
The ZC pin is a CMOS Schmitt trigger input pin. Using suitable ZC signal switching, the device can provide the following functions:
* Override control
AC
2M W 1M W ZC
When the device is operating in the AUTO mode, which is when the MODE pin is open, the output will be activated by a valid PIR trigger signal and the output active duration will be controlled by a DT oscillating period. The mode can be switched from the AUTO mode to the ON mode by either connecting the MODE pin to VDD or switching the ZC signal with an OFF/ON operation of the power switch. The term override refers to the change of operating mode by switching the power switch. The device can be toggled from ON to AUTO by an override operation. If the
Fig.6 ZC Application Example Note: Regarding the priority of the MODE pin and the ZC switching, note that when the MODE pin is connected to VDD or VSS, the MODE state will be determined by the MODE pin. When the MODE pin is OPEN, the MODE state will be determined by the ZC switching.
fla s h O p e r a tin g M ode
fla s h
AUTO
ON 8hr
AUTO
ON < 8hr
AUTO
< 3sec ZC A lw a y s h ig h o r a lw a y s L o w
> 30m s
Fig.5 ZC Override Timing
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HT7612/HT7612B
CDS The CDS pin is connected to an internal comparator input. It is used to allow the device to distinguish between day and night conditions. When the CDS input voltage is lower than VL, the PIR amplifier circuit will be disabled and the TRIAC and RELAY output pins will be inactive. When the input voltage of the CDS is higher than VL, the outputs are both active. The debounce time for the CDS pin for switching the outputs from an inactive to an active state is about 15~20 seconds for the HT7612 and less than 3 seconds for the HT7612B. Connect this pin to VDD when this function is not used. The CDS timing is shown in Fig.7 CDS Low High
CDS
LED The LED pin is a CMOS output pin which is used as a valid trigger indicator. When the TRIAC/RELAY is activated, this pin will be active until the TRIAC/RELAY has is switched OFF. The LED pin structure is shown in Fig.9.
R E L A Y /L E D 1kW T r ig g e r In d ic a to r
Status Day Time Night
Output Disabled Enabled LVD LVD is a low voltage detector. When the detected voltage is lower than 1.1V, the LED flicker and the buzzer will emit a tone. Fig. 9 LED Pin Drive LED
T R IA C & R ELAY
A c tiv e
In a c tiv e
A c tiv
In Fig10, assume RX, RLVD can be adjusted to obtain the desired voltage detection level.
V
DD
Fig.7 CDS Timing In Fig.8, RCDS and RY can be adjusted to obtain the desired daytime detection level.
Y
R
X
V
B U Z /L V D + 1 .1 V R T E S T /S C
LVD
REF
R B U Z /C D S + V
L
Fig.8 CDS Application Example
VREF
Comp1
D
S G Regulator
PIR Sensor
Comparator Input VL
Rev. 1.50
-
R
CDS
Fig.10 LVD Application Example
T E S T /S C
VREF
VH VH Output VM OP2 VM VL VREF
Comp2
OP1
VL
VH
PIR Amplifier
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February 21, 2011
HT7612/HT7612B
Effective Trigger Timing The effective input trigger signal width should be 24ms. The output is valid either with (1) trigger signal width 0.5 seconds or (2) more than 2 effective trigger inputs within 2 seconds (separation of 2 triggers 0.5s). The separation time between two TRIAC(RELAY) turn-on time must be more than 1 sec. The trigger timing is shown in Fig.11.
Fig.11 Trigger Timing Retrigger When the output of the comparator is a valid signal, the RELAY/TRIAC will be activated and the active duration is controlled by the DT oscillating period. If the previous Delay Time tD has not been exceeded and the next valid signal occurs again, the active duration of the RELAY/TRIAC will be restarted. The timing is shown in Fig.12.
Fig.12 Retrigger
Rev. 1.50
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HT7612/HT7612B
LVD & CDS Detecting Circuit The external and internal detecting circuits for LVD and CDS are shown in Fig.13. When the input voltage VLVD is lower than 1.1V, the comparator outputs a low level which means that VDD is lower than the minimum operating voltage (Vmin). When VCDS is lower than VL, the comparator outputs a high level which means that it is daytime, otherwise it is night. Where
V
LVD
V
DD
V R
X
REF
R
Y
B U Z /L V D B U Z /C D S R T E S T /S C
LVD
R
CDS
Fig.13 External Application Circuit
= R R
LVD LVD
+R
X CDS
V
DD
Note:
V
CDS
= R
R
CDS
+R
Y
V
REF
When the CDS input voltage is lower than VL, it means that a daytime condition exists for the PIR circuit.
Relationship LVD and CDS The LVD and CDS trigger timing are shown in Fig.14 and Fig.15 respectively. In Fig.14, When an LVD condition occurs, the LED will flicker and the buzzer will emit a tone. In Fig.15, When the CDS state changes from low to high, the output of the PIR is enabled after 10 sec for the HT7612 or 0 sec for the HT7612B, and when the CDS sate changes from high to low, will be disabled.
Fig.14 Trigger Timing of LVD
CDS State (Internal signal) 10 sec for HT7612 0 sec for HT7612B + Trigger Level
Output Enable
Comparator Input
Comparator Output
- Trigger Level
Fig.15 Trigger Timing of CDS Rev. 1.50 8 February 21, 2011
HT7612/HT7612B
Trigger Timing
Note:
The output is activated if the trigger signal conforms to the following criteria: 1. Two triggers occur within 2 seconds and separation time between two triggers is more than 0.5sec. 2. The trigger signal sustains duration 0.5 seconds.
Rev. 1.50
9
February 21, 2011
HT7612/HT7612B
R10 D S R1 56K C3 R2 2 OP1N R7 1M 3 OP1O C6 0.02uF BUZ/LVD 14 W1 13 BUZB/CDS Buzzer Jumper ON 5 OP2O MODE 12 2 AUTO OFF R15 6 R6 1M C4 1uF 7 C8 3nF 8 VSS VDD 9 C12 0.1uF TD TRIAC 10 0.1uF Vref RELAY/LED 11 LED 1K C15 R19 68 Triac 3 R18 10K 1 D3 5V D2 22K R3 22K 4 OP2N R5 1M C7 0.02uF 22uF C2 22uF G PIR ZC C1 0.02uF OP1P TEST/SC 1 16 CDS 15 R16 R9 1M 100 /2W 1M R11 2.4M R20 1M
R17 680K
C10
0.68uF/ 350V
AC 110V 1N4004 C11 100uF D4 1N4004
Adjust R9 to fit various CDS. Adjust R6 to obtain the desired output duration. Adjust R5 to change PIR sensitivity. Change the value of C10 to 0.33mF/600V for AC 220V application.
HT7612/HT7612B
GND
LAMP1
Lamp for TRIAC
Application Circuit
AC Power Application
Rev. 1.50
* TRIAC
Note:
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February 21, 2011
HT7612/HT7612B
R10 D S R1 56K C3 R2 2 OP1N ZC R7 1M 3 OP1O BUZ/LVD 14 W1 13 Buzzer Jumper ON 5 OP2O MODE 12 2 AUTO OFF 6 Vref R6 1M C4 1uF C8 3nF 8 VSS VDD 9 C12 0.1uF 7 TD TRIAC 10 D2 1N4004 RELAY/LED 11 3 1 C9 10uF HT7150-1 3 OUT GND 1 D3 24V C11 IN 2 1 C6 0.02uF 15 R9 1M 22K R3 22K 4 OP2N R5 1M C7 0.02uF 22uF C2 22uF BUZB/CDS G PIR C1 0.02uF CDS OP1P TEST/SC 1 16 1M R11 2.4M R19 1M
R17 680K
R16
C10
100
/2W
0.68uF/ 350V
2
D4 Bridge1 3
AC 110V
4
100uF/50V
Adjust R9 to fit various CDS. Adjust R6 to obtain the desired output duration. Adjust R5 to change PIR sensitivity. Change the value of C10 to 0.33mF/600V for AC 220V application.
HT7612/HT7612B
GND R14 10K LED R15 1K GND Q1 8050
RELAY1 Relay-SPST
LAMP1 Lamp for RELAY
Rev. 1.50
* RELAY
Note:
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February 21, 2011
HT7612/HT7612B
R10 D S R1 56K C3 R2 2 OP1N ZC 15 R9 1M 14 W1 13 Buzzer Jumper C12 2.2uF D2 D3 2 3 Rfb 10 MODE 12 GND 6 Vref R6 1M C4 1uF C8 3nF 8 VSS VDD 9 1 7 TD TRIAC 10 VCC RELAY/LED 11 R7 1M 3 OP1O BUZ/LVD C6 0.02uF 22K R3 22K 4 OP2N R5 1M C7 0.02uF 5 OP2O 22uF C2 22uF G PIR C1 0.02uF CDS D1 D4 1N5819 L1 10uH OP1P TEST/SC 1 16 R8 680K 1M
1
SW GND FB HT7939
VIN OVP EN
6 5 4 Rsh 100K
C11 22uF
GND
BUZB/CDS
HT7612/HT7612B
ON AUTO 2 3 OFF C10 0.1uF C9 100uF 4.5V Battery
4.5V DC Power Application Circuit
GND
Adjust R9 to fit various CDS. Adjust R6 to obtain the desired output duration. Adjust R5 to change PIR sensitivity.
Rev. 1.50
Note:
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February 21, 2011
HT7612/HT7612B
R8 680K D S R1 56K C3 R2 2 OP1N 15 14 ZC R7 1M 3 OP1O BUZ/LVD C6 0.02uF 22K R3 22K 4 OP2N R5 1M C7 0.02uF 5 OP2O MODE 12 22uF C2 22uF G PIR C1 0.02uF Photo-transistor OP1P TEST/SC 1 16
R10 1M
D1
D4 C12 2.2uF R9 1M W1 D2 D3 Buzzer Jumper
1N5819
L1 10uH
1 2 3
SW GND 13 FB Rfb 10 HT7939
VIN OVP EN
6 5 4 Rsh 100K
C11 22uF
GND
BUZB/CDS
6 Vref R6 1M C4 1uF C8 3nF 8 VSS 7 TD
RELAY/LED
11
TRIAC
10 VCC VDD 9 1
HT7612/HT7612B
ON AUTO 3 OFF 2 C10 0.1uF C9 100uF 4.5V Battery
Photo-transistor Application Circuit
GND
Rev. 1.50
Note:
13
GND
Adjust R9 to fit various CDS. Adjust R6 to obtain the desired output duration. Adjust R5 to change PIR sensitivity. Use a Photo-transistor instead of a CDS to meet European RoHS standards.
February 21, 2011
HT7612/HT7612B
Package Information
16-pin DIP (300mil) Outline Dimensions
A
16 9 16
A
9 8
B
B
8
1
1
H C D E F G I D E F G C
H
I
Fig1. Full Lead Packages
Fig2. 1/2 Lead Packages
* MS-001d (see fig1)
Symbol A B C D E F G H I
Dimensions in inch Min. 0.780 0.240 0.115 0.115 0.014 0.045 3/4 0.300 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 0.100 3/4 3/4 Dimensions in mm Min. 19.81 6.10 2.92 2.92 0.36 1.14 3/4 7.62 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 2.54 3/4 3/4 Max. 22.35 7.11 4.95 3.81 0.56 1.78 3/4 8.26 10.92 Max. 0.880 0.280 0.195 0.150 0.022 0.070 3/4 0.325 0.430
Symbol A B C D E F G H I
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February 21, 2011
HT7612/HT7612B
* MS-001d (see fig2)
Symbol A B C D E F G H I
Dimensions in inch Min. 0.735 0.240 0.115 0.115 0.014 0.045 3/4 0.300 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 0.100 3/4 3/4 Dimensions in mm Min. 18.67 6.10 2.92 2.92 0.36 1.14 3/4 7.62 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 2.54 3/4 3/4 Max. 19.69 7.11 4.95 3.81 0.56 1.78 3/4 8.26 10.92 Max. 0.775 0.280 0.195 0.150 0.022 0.070 3/4 0.325 0.430
Symbol A B C D E F G H I
Rev. 1.50
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February 21, 2011
HT7612/HT7612B
* MO-095a (see fig2)
Symbol A B C D E F G H I
Dimensions in inch Min. 0.745 0.275 0.120 0.110 0.014 0.045 3/4 0.300 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 0.100 3/4 3/4 Dimensions in mm Min. 18.92 6.99 3.05 2.79 0.36 1.14 3/4 7.62 3/4 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 2.54 3/4 3/4 Max. 19.94 7.49 3.81 3.81 0.56 1.52 3/4 8.26 10.92 Max. 0.785 0.295 0.150 0.150 0.022 0.060 3/4 0.325 0.430
Symbol A B C D E F G H I
Rev. 1.50
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February 21, 2011
HT7612/HT7612B
16-pin NSOP (150mil) Outline Dimensions
A 1
16 9 8
B
C C' G H D E F
a
* MS-012
Symbol A B C C D E F G H a Symbol A B C C D E F G H a
Dimensions in inch Min. 0.228 0.150 0.012 0.386 3/4 3/4 0.004 0.016 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.050 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.30 9.80 3/4 3/4 0.10 0.41 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 1.27 3/4 3/4 3/4 3/4 Max. 6.20 3.99 0.51 10.21 1.75 3/4 0.25 1.27 0.25 8 Max. 0.244 0.157 0.020 0.402 0.069 3/4 0.010 0.050 0.010 8
Rev. 1.50
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HT7612/HT7612B
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
Rev. 1.50
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February 21, 2011
HT7612/HT7612B
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P A0
K0
R e e l H o le p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . IC
SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.00.3 8.00.1 1.750.1 7.50.1 1.55 1.50
+0.10/-0.00 +0.25/-0.00
4.00.1 2.00.1 6.50.1 10.30.1 2.10.1 0.300.05 13.30.1
Rev. 1.50
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February 21, 2011
HT7612/HT7612B
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2011 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.50
20
February 21, 2011

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